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Microscale heat transfer enhancement using thermal boundary layer redeveloping concept
Xu, JL; Gan, YH; Zhang, DC; Li, XH
2005-04-01
Source PublicationINTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume48Issue:9Pages:1662-1674
AbstractWe demonstrated a new silicon microchannel heat sink, composing of parallel longitudinal microchannels and several transverse microchannels, which separate the whole flow length into several independent zones, in which the thermal boundary layer is in developing. The redeveloping flow is repeated for all of the independent zones thus the overall heat transfer is greatly enhanced. Meanwhile, the pressure drops are decreased compared with the conventional microchannel heat sink. Both benefits of enhanced heat transfer and decreased pressure drop ensure the possibility to use "larger" hydraulic diameter of the microchannels so that less pumping power is needed, which are attractive for high heat flux chip cooling. The above idea fulfilled in microscale is verified by a set of experiments. The local chip temperature and Nusselt numbers are obtained using a high resolution Infrared Radiator Imaging system. Preliminary explanation is given on the decreased pressure drop while enhancing heat transfer. The dimensionless control parameter that guides the new heat sink design and the prospective of the new heat sink are discussed. (c) 2005 Elsevier Ltd. All rights reserved.
SubtypeArticle
WOS HeadingsScience & Technology ; Physical Sciences ; Technology
DOI10.1016/j.ijheatmasstransfer.2004.12.008
WOS Subject ExtendedThermodynamics ; Engineering ; Mechanics
WOS KeywordMICROCHANNELS ; FLOW
Indexed BySCI
Language英语
WOS SubjectThermodynamics ; Engineering, Mechanical ; Mechanics
WOS IDWOS:000228237000002
Citation statistics
Cited Times:184[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.giec.ac.cn/handle/344007/10227
Collection中国科学院广州能源研究所
Affiliation1.Chinese Acad Sci, Guangzhou Inst Energy Convers, Guangzhou 510640, Peoples R China
2.Univ Sci & Technol China, Dept Thermal & Energy Engn, Hefei 230027, Anhui Province, Peoples R China
3.Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
Recommended Citation
GB/T 7714
Xu, JL,Gan, YH,Zhang, DC,et al. Microscale heat transfer enhancement using thermal boundary layer redeveloping concept[J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER,2005,48(9):1662-1674.
APA Xu, JL,Gan, YH,Zhang, DC,&Li, XH.(2005).Microscale heat transfer enhancement using thermal boundary layer redeveloping concept.INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER,48(9),1662-1674.
MLA Xu, JL,et al."Microscale heat transfer enhancement using thermal boundary layer redeveloping concept".INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER 48.9(2005):1662-1674.
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